This report contains market size and forecasts of Wafer Backgrinding Tape in global, including the following market information:
Global Wafer Backgrinding Tape Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Wafer Backgrinding Tape Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Wafer Backgrinding Tape companies in 2021 (%)
The global Wafer Backgrinding Tape market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Polyolefin (PO) Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Wafer Backgrinding Tape include Furukawa, Nitto Denko, Mitsui Corporation, Lintec Corporation, Sumitomo Bakelite, Denka Company, Pantech Tape, Ultron Systems and NEPTCO, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Wafer Backgrinding Tape manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wafer Backgrinding Tape Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Wafer Backgrinding Tape Market Segment Percentages, by Type, 2021 (%)
Polyolefin (PO)
Polyvinyl Chloride (PVC)
Polyethylene Terephthalate (PET)
Other
Global Wafer Backgrinding Tape Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Wafer Backgrinding Tape Market Segment Percentages, by Application, 2021 (%)
IDMs
OSAT
Global Wafer Backgrinding Tape Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Wafer Backgrinding Tape Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wafer Backgrinding Tape revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Wafer Backgrinding Tape revenues share in global market, 2021 (%)
Key companies Wafer Backgrinding Tape sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Wafer Backgrinding Tape sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Furukawa
Nitto Denko
Mitsui Corporation
Lintec Corporation
Sumitomo Bakelite
Denka Company
Pantech Tape
Ultron Systems
NEPTCO
Nippon Pulse Motor
Loadpoint Limited
AI Technology
Minitron Electronic
Table of content
1 Introduction to Research & Analysis Reports
1.1 Wafer Backgrinding Tape Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Wafer Backgrinding Tape Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Wafer Backgrinding Tape Overall Market Size
2.1 Global Wafer Backgrinding Tape Market Size: 2021 VS 2028
2.2 Global Wafer Backgrinding Tape Revenue, Prospects & Forecasts: 2017-2028
2.3 Global Wafer Backgrinding Tape Sales: 2017-2028
3 Company Landscape
3.1 Top Wafer Backgrinding Tape Players in Global Market
3.2 Top Global Wafer Backgrinding Tape Companies Ranked by Revenue
3.3 Global Wafer Backgrinding Tape Revenue by Companies
3.4 Global Wafer Backgrinding Tape Sales by Companies
3.5 Global Wafer Backgrinding Tape Price by Manufacturer (2017-2022)
3.6 Top 3 and Top 5 Wafer Backgrinding Tape Companies in Global Market, by Revenue in 2021
3.7 Global Manufacturers Wafer Backgrinding Tape Product Type
3.8 Tier 1, Tier 2 and Tier 3 Wafer Backgrinding Tape Players in Global Market
3.8.1 List of Global Tier 1 Wafer Backgrinding Tape Companies
3.8.2 List of Global Tier 2 and Tier 3 Wafer Backgrinding Tape Companies
4 Sights by Product
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